MAX1967EUB Datasheet Download

Part No.:
MAX1967EUB
Download:
Download Datasheet
Description:
[PLASTIC ENCAPSULATED DEVICES]
File Size:
94 K
Page:
8 Pages
Logo:
Manufacturer:
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
PCB Prototype
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II. Manufacturing Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
Low-Cost, Wide Input Range, Step-Down Controllers with Foldback Current Limit
B8 (Standard 0.8 micron silicon gate CMOS)
3007
California, USA
Thailand, Philippines or Malaysia
July, 2003
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112:
10-Pin ┬ÁMAX
Copper
Solder Plate
Silver-Filled Epoxy
Gold (1.0 mil dia.)
Epoxy with silica filler
# 05-3501-0016
Class UL94-V0
Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
58 x 72 mils
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
Aluminum/Si (Si = 1%)
None
0.8 microns (as drawn)
0.8 microns (as drawn)
5 mil. Sq.
SiO
2
Wafer Saw