CY62148ELL-55SXI Datasheet Download

Part No.:
CY62148ELL-55SXI
Download:
Download Datasheet
Description:
[4-Mbit (512K x 8) Static RAM]
File Size:
942 K
Page:
10 Pages
Logo:
Manufacturer:
CYPRESS [ CYPRESS SEMICONDUCTOR ]
PCB Prototype
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CY62148E MoBL
®
Thermal Resistance
Parameter
Θ
JA
Θ
JC
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test Conditions
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
SOIC
Package
75
10
TSOP II
Package
77
13
Unit
°C/W
°C/W
AC Test Loads and Waveforms
V
CC
OUTPUT
R1
3.0V
30 pF
INCLUDING
JIG AND
SCOPE
R2
GND
Rise Time = 1 V/ns
10%
ALL INPUT PULSES
90%
90%
10%
Fall Time = 1 V/ns
Equivalent to:
THEVENIN
EQUIVALENT
OUTPUT
Parameters
R1
R2
R
TH
V
TH
5.0V
1800
990
639
1.77
R
TH
V
Unit
V
Data Retention Characteristics
(Over the Operating Range)
Parameter
V
DR
I
CCDR
t
CDR [10]
t
R [11]
Description
V
CC
for Data Retention
Data Retention Current
Chip Deselect to Data Retention Time
Operation Recovery Time
Ind’l/Auto-A
V
CC
= V
DR
, CE > V
CC
– 0.2V,
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
0
t
RC
Conditions
Min
2
1
7
Typ
Max
Unit
V
µA
ns
ns
Data Retention Waveform
DATA RETENTION MODE
V
CC
V
CC(min)
t
CDR
V
DR
> 2.0V
V
CC(min)
t
R
CE
Note
11. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100
µs
or stable at V
CC(min)
> 100
µs.
Document #: 38-05442 Rev. *F
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